| 摘要 |
The present invention relates to a silver alloy bonding wire, more specifically, to a silver alloy bonding wire which includes Ag as a main element, 0.5 to 4 wt% of Pd, and 2 to 8 wt% of Au. The ratio (a/b) of the average grain size (a) of a lateral part against the average grain size (b) of a center part on a vertical cross section in the longitudinal direction of the bonding wire is 0.3 to 30. The bonding wire has strong thermal impact strength, an excellent SOB bonding property, and an excellent bonding property under nitrogen atmosphere. |
