| 摘要 |
The present invention relates to a method for manufacturing a multi-layer PCB with plated through-holes, and, more specifically, to a multi-layer PCB (MLB) in which multiple non-conductive layers and conductive layers are alternately laminated and inner wall of a through-hole is electro-plated to electrically connect an inter-layer conductor. The method for manufacturing a multi-layer PCB with plated through-holes includes a process of putting a board in a solution with nano bubbles before a pre-etching process for the multi-layer PCB or before micro-etching process for removing a carbon coating layer applied to a conductor before plating. Therefore, the etching process can be carried out stably and rapidly even etching can be guaranteed even if the use amount of hydrogen peroxide is reduced. |
