MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to a multi-layered substrate and a manufacturing method thereof. The multi-layered substrate includes a plurality of wiring layers. Manufacturing efficiency is improved and warpage is reduced at the same time by installing a reinforcement layer which reduces warpage on the outermost part of both surfaces of the multi-layered substrate and optimizing a wiring pattern according to the arrangement of an external electrode on an electronic component.