发明名称 |
LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME |
摘要 |
Exemplary embodiments of the present invention provide light emitting diode (LED) chips and a method of fabricating the same. An LED chip according to an exemplary embodiment includes a substrate; a light emitting structure arranged on the substrate, and an alternating lamination bottom structure arranged under the substrate. The alternating lamination bottom structure includes a plurality of dielectric pairs, each of the dielectric pairs including a first material layer having a first refractive index and a second material layer having a second refractive index, the first refractive index being greater than the second refractive index. |
申请公布号 |
EP2656402(A4) |
申请公布日期 |
2014.07.09 |
申请号 |
EP20110850200 |
申请日期 |
2011.06.13 |
申请人 |
SEOUL VIOSYS CO., LTD |
发明人 |
HEO, MIN CHAN;JIN, SANG KI;KIM, JONG KYU;SHIN, JIN CHEOL;LEE, SO RA;LEE, SUM GEUN |
分类号 |
G02B1/10;G02B5/08;G02B5/28;H01L33/00;H01L33/08;H01L33/20;H01L33/32;H01L33/46;H01L33/50;H01L33/60;H01L33/62 |
主分类号 |
G02B1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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