发明名称
摘要 The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.
申请公布号 JP5544714(B2) 申请公布日期 2014.07.09
申请号 JP20080522533 申请日期 2007.06.22
申请人 发明人
分类号 H01L23/50;H01L23/12;H01L23/28;H01L25/10;H01L25/11;H01L25/18 主分类号 H01L23/50
代理机构 代理人
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