| 摘要 |
The invention relates to an electroplating shielding plate and an electroplating device having the same, more specifically, to the electroplating shielding plate which allows the plating deviation to be improved and the electroplating device having the same. The invention relates to the electroplating shielding plate which is arranged between an anode and a cathode and provides a current uniformity, comprising: a base shielding panel which includes a plurality of base through-holes; and a current amount controlling member which is installed on the both surfaces of base shielding panel and controls the degree of opening of base through-holes. Moreover, the electroplating device of the invention comprises: a cathode to which a jig and a substrate are fixed; a nozzle pipe which sprays the plating solution to the substrate fixed to the cathode; an anode case which includes an inserting groove for inserting the nozzle pipe and has an anode inserting unit on the both sides of inserting groove; an anode which is inserted into the anode inserting unit of anode case; a partition membrane which is installed closely in the anode inserting unit to block the hydrogen gas generated from the anode; the base shielding panel which includes a plurality of base through-holes between the anode and the cathode; and the current amount controlling member which is installed on the both surfaces of base shielding panel and controls the degree of opening of base through-holes. |
