发明名称 3D MOLD FOR MANUFACTURE OF SUB-MICRON 3D STRUCTURES USING 2-D PHOTON LITHOGRAPHY AND NANOIMPRINTING AND PROCESS THEREOF
摘要 A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
申请公布号 EP2361402(A4) 申请公布日期 2014.07.09
申请号 EP20090835361 申请日期 2009.11.23
申请人 HELIOS APPLIED SYSTEMS PTE LTD 发明人 KAN, SHYI-HERNG
分类号 G03F1/00;B82Y10/00;B82Y40/00;G03F7/00;G03F7/20;G03F7/24;G03F7/40 主分类号 G03F1/00
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