DIE PRESS PROCESS FOR MANUFACTURING A Z-DIRECTED COMPONENT FOR A PRINTED CIRCUIT BOARD
摘要
<p>A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.</p>
申请公布号
EP2752102(A1)
申请公布日期
2014.07.09
申请号
EP20120827168
申请日期
2012.08.24
申请人
LEXMARK INTERNATIONAL, INC.
发明人
HALL, PAUL, KEVIN;HARDIN, KEITH BRYAN;KRATZER, ZACHARY, CHARLES NATHAN;ZHANG, QING