| 发明名称 |
ADHESIVE COMPOSITION FOR BONDING WATER AND SUPPORTING BODY FOR SAID WAFER, ADHESIVE FILM, AND LAMINATE |
| 摘要 |
The adhesive composition for bonding a wafer and a support for the wafer according to the present invention contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight is 10,000 to 200,000. |
| 申请公布号 |
KR20140088156(A) |
申请公布日期 |
2014.07.09 |
| 申请号 |
KR20147013338 |
申请日期 |
2012.09.20 |
| 申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
IMAI HIROFUMI;OGATA TOSHIYUKI;KUBO ATSUSHI;YOSHIOKA TAKAHIRO |
| 分类号 |
C09J153/02;C09J7/02;C09J109/06;H01L21/304 |
主分类号 |
C09J153/02 |
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