| 摘要 |
A circuit board assembly 15 comprises a module which comprises: a first substrate 7 having first and second faces 8,9, with a first conductive region 11 disposed on the first face 8 of the first substrate 7 and a hole 14 in or adjacent to the first conductive region 11 and passing through the first substrate 7 between the first 8 and second 9 faces; and a circuit board which comprises a second substrate 4 having first 5 and second faces, a second conductive region 6 disposed on the first face 5 of the second substrate 4, where conductive ink 15 is disposed in the hole 14 and between the first 7 and second 4 substrates; further the module is mounted to the circuit board and is arranged such that the hole 14 lies over or adjacent to the second conductive region 6 and the conductive ink 15 provides an electrical connection between first 11 and second 6 conductive regions. Preferably either or both of the first 7 and second 4 substrates are flexible, further they may be formed of paper, card, cardboard or plastic. The assembly may further comprise a printed article or part of a printed article supporting printed indicia. |
