SEMICONDUCTOR MODULE PACKAGE

摘要

A semiconductor module package according to an embodiment of the present invention comprises a first module which includes a first heat radiating substrate and one or more first semiconductor devices and has a first N terminal and a first P terminal on one end; and a second module which includes a second heat radiating substrate and one or more second semiconductor devices, has a second N terminal and a second P terminal on one end, and is disposed to face the first module. The semiconductor module package further comprises a first output terminal formed as the first module and the second module are electrically connected to each other.