发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>Provided in the present invention is a positive type photosensitive resin composition which comprises (A) an alkali-soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination of the same; (B) a photosensitive diazoquinone compound; (C) a multi-functional urethane (meth) acrylate compound; and (D) a solvent.</p>
申请公布号 KR20140087645(A) 申请公布日期 2014.07.09
申请号 KR20120158168 申请日期 2012.12.31
申请人 CHEIL INDUSTRIES INC. 发明人 KWON, JI YUN;KIM, SANG SOO;YOON, EUN KYUNG;LEE, JONG HWA;LEE, JUN HO;LEE, JIN YOUNG;CHO, HYUN YONG;HWANG, EUN HA
分类号 G03F7/039;G03F7/022;G03F7/09;H01L21/027 主分类号 G03F7/039
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