| 摘要 |
The present invention provides a substrate for an LED, which includes a ceramic substrate and a copper plate which is bonded to one or both sides of the ceramic substrate with a direct copper bonding method. The substrate and a heat dissipation structure for the LED manufactured by the present invention efficiently controls heat during an LED operation by reducing the heat from a copper surface by increasing a heat discharge cross section by increasing the thickness of the copper in comparison to an existing product. |
