| 发明名称 | Integrated circuit package system employing mold flash prevention technology | ||
| 摘要 | An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess. | ||
| 申请公布号 | US8772916(B2) | 申请公布日期 | 2014.07.08 |
| 申请号 | US201213536382 | 申请日期 | 2012.06.28 |
| 申请人 | Stats Chippac Ltd. | 发明人 | Jang Ki Youn;Song Sungmin;Bae JoHyun |
| 分类号 | H01L23/31 | 主分类号 | H01L23/31 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. An integrated circuit package system comprising: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. | ||
| 地址 | Singapore SG | ||