APPARATUS FOR EMITING SCRAP OF SEMICONDUCTOR PACKAGE SAWING EQUIPMENT

摘要

The present technique relates to an apparatus for discharging the scrap of semiconductor package sawing equipment. An apparatus for discharging the scrap according to the present technique includes a main frame; a driving unit which is installed at the main frame and provides a driving force; a moving unit which includes a support part which reciprocates in an X axis by the driving force of the driving unit and supports a chuck table for mounting scraps, a first moving part which is combined with one side of the support part, a second moving part which is combined with the other side of the support part and guides the discharge of the scraps generated when the scraps are cut; and a guide unit which is fixed to the main frame and guides the X-axis movement of the moving unit.