Edge protection seal for bonded substrates

摘要

A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.

主权项

1. A method of sealing a bonded structure comprising:
bonding a first substrate and a second substrate, wherein a first bonding-side surface of said first substrate is bonded to a second bonding-side surface of said second substrate at an interface; forming a dielectric material layer on a first sidewall surface at a periphery of said first substrate and a second sidewall surface at a periphery of said second substrate, wherein said dielectric material layer contiguously extends from a periphery of a first backside surface of said first substrate to a second backside surface of said second substrate and seals said interface; and thinning said second substrate by planarization.