发明名称 |
Electroless gold plating solution and electroless gold plating method |
摘要 |
It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 μm or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. |
申请公布号 |
US8771409(B2) |
申请公布日期 |
2014.07.08 |
申请号 |
US201113388752 |
申请日期 |
2011.04.15 |
申请人 |
Electroplating Engineers of Japan Limited |
发明人 |
Asakawa Takanobu;Fujinami Tomoyuki |
分类号 |
C23C18/42;C23C18/44 |
主分类号 |
C23C18/42 |
代理机构 |
Roberts & Roberts, LLP |
代理人 |
Roberts & Roberts, LLP |
主权项 |
1. An electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine. |
地址 |
Tokyo JP |