发明名称 EMBEDDED MULTILAYER CAPACITOR AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CAPACITOR
摘要 <p>The present invention provides an embedded multilayered ceramic electronic component comprising: a ceramic body which includes a dielectric layer, first and second main surfaces facing each other, first and second sides facing each other, and first and second sections facing each other, wherein the thickness of the ceramic body is smaller than or equal to 250 micrometers; first and second internal electrodes which are arranged to face each other with the dielectric layer between them and alternately exposed to the first or second sides; first and second external electrodes which are formed on the first and second sides of the ceramic body and connected to first and second internal electrodes, respectively; and a metal layer containing copper formed on the first and second external electrodes. The ceramic body includes an active layer having the first and second internal electrodes and a cover layer formed on the upper or lower surface of the active layer. A relation, tp >= 5 micrometers, is satisfied, wherein tp denotes the thickness of the metal layer.</p>
申请公布号 KR20140086481(A) 申请公布日期 2014.07.08
申请号 KR20120157037 申请日期 2012.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JIN WOO;CHAE, EUN HYUK;LEE, BYOUNG HWA
分类号 H01G4/12;H01G4/30;H05K1/18 主分类号 H01G4/12
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