| 摘要 |
The present invention relates to a die bonding method and a die bonding apparatus. After a substrate where dies are to be attached is transferred to a die attachment area, a plurality of dies are attached on the substrate by a die attachment module. Then, after the substrate is conveyed to the die attachment area, the dies, which are attached on the substrate in the die attachment area, are heated at a preset temperature. The dies are pressurized at a preset pressure by using the die attachment module such that the dies are bonded on the substrate. By thermo-compressing the dies at the same time as described above, time required for a die bonding process is greatly reduced. |
