| 摘要 |
The present invention relates to a substrate chuck and a substrate bonding device comprising the same. The substrate bonding device comprises: a through hole formed to communicate with the bottom side of the substrate chuck; the substrate chuck moving up and down inside the through hole, having an intake pipe longitudinally formed therein, and including a bonding unit having a bonding member formed on the bottom side of the end thereof. Accordingly, substrates are bonded or separated by being lifted up and down along the substrate chuck, thereby preventing sinkage and spots on the substrates due to physical contact during separation of the substrates. |
