PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND PRODUCING METHOD THEREOF

摘要

The present invention provides a printed circuit board which includes a copper plating layer in an anisotropic crystal orientation structure by using a plating inhibitor when the copper plating layer playing a role as circuit wiring is formed and has roughness in an anchor shape on the surface of the copper plating layer by using combined gas plasma and a diluted acid solution, and a producing method thereof.