发明名称 PREPREG, PREPARING METHOD THEREOF, AND COPPER CLAD LAMINATE USING THE SAME
摘要 <p>The present invention provides: a prepreg which comprises hybrid fibers whereby inorganic fibers coated or impregnated with a heat conductive composition, organic fibers, or both are mix weaved, and a crosslinkable resin whereby the fiber is impregnated; a preparation method thereof; and a copper clad laminate using the same. According to the present invention, the prepreg and the copper clad laminate maintains low coefficient of expansion and high elastic modulus while enhancing heat dissipation properties.</p>
申请公布号 KR20140086517(A) 申请公布日期 2014.07.08
申请号 KR20120157124 申请日期 2012.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN, SANG HYUN;KANG, JOON SEOK;SON, JANG BAE;LEE, KWANG JIK;SHIN, HYE SOOK;JUNG, HYUN CHUL
分类号 C08J5/24;B32B15/092;C08K7/02;C08L63/00 主分类号 C08J5/24
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