| 摘要 |
A surface of a substrate is cleaned at a high cleanness degree by using original cleaning characteristics of two-fluid jet cleaning. The substrate cleaning apparatus includes a substrate holding mechanism (40), which holds and supports the substrate (W) horizontally by including the surface facing the lower side downwards, and a two-fluid nozzle (46) which jets a two-fluid jet flow of gas and liquid upwards toward the surface (lower surface) of the substrate (W) held by the substrate holding mechanism (40). |
