Device and method for transferring micro structure

摘要

A microstructure transferring device is characterized in that the device comprises a stamper made from a first photo-curable resin composition cured with light with a first wavelength, and a light source emitting light with a second wavelength longer than the first wavelength. The microstructure is transferred to an impression receptor supplied with a second photo-curable resin composition, which is curable with light with the second wavelength emitted by the light source.

主权项

1. A microstructure transferring device for transferring a microstructure to a photo-curable resin composition supplied to an impression receptor comprising:
a stamper having the microstructure configured to be pressed against a second photo-curable resin composition applied to the impression receptor and removed from the supplied second photo-curable resin composition after cured; a light source emitting a second wavelength light, whose wavelength is longer than a first wavelength, the second wavelength light being capable of curing the second photo-curable resin composition, and being configured to pass through the stamper to the second photo-curable resin composition while the stamper is being pressed against the second photo-curable resin composition supplied to the impression receptor in order to cure the supplied second photo-curable resin composition; a pressing member configured to press the stamper against the second photo-curable resin composition supplied to the impression receptor; and an optical filter, which is disposed at the pressing member, and which absorbs light with a range of wavelengths shorter than the second wavelength, wherein the light source is configured to expose the second photo-curable resin composition supplied to the impression receptor to light passing through the optical filter before reaching the second photo-curable resin composition, and wherein the stamper is formed by pressing, against a first photo-curable resin composition, a master stamper having the microstructure, by curing the first photo-curable resin composition by exposing the first photo-curable resin composition to light with the first wavelength, and by removing the master stamper from the cured first photo-curable resin composition.