| 摘要 |
The present invention relates to a heat sink structure for an IPM circuit and LED lighting. The heat sink structure includes a base plate (10); a plurality of thermal conductive plates (20) provided in an upright state integrally with the base plate (10) while being spaced apart from each other by a predetermined distance on the base plate (10); and a heat sink (30) formed by coating a heat radiation resin composition at a predetermined thickness on the pase plate (10) and the thermal conductive plates (20). A heat radiation member is applied to an entire portion of the heat sink of the base plate, which is a bottom plate having the shape of a dovetail including intaglio or embossment, so that the heat radiation member is not separated from a heat radiation body, or the heat sink is provided without the thermal conductive plate. A plurality of spherical balls are applied to the surface of the base plate having the shape of a flat plane without the thermal conductive plates, so that the surficial area is increased due to the spherical balls, the weight is reduced, and heat transmission efficiency to the heat sink is increased. Accordingly, superior heat radiation efficiency can be represented, and the manufacturing process of a product can be simplified. Therefore, since the manufacturing process can be simplified when configuring the IPM module and the LED module, a self-waterproof function is possible, so that the durability of the product can be improved and the manufacturing costs can be reduced. |
