| 发明名称 | Electronic device | ||
| 摘要 | An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer. | ||
| 申请公布号 | US8772912(B2) | 申请公布日期 | 2014.07.08 |
| 申请号 | US201012974166 | 申请日期 | 2010.12.21 |
| 申请人 | DENSO CORPORATION | 发明人 | Miyawaki Shotaro;Kawashima Katsuhiko;Kashiwazaki Atsushi;Yoshimizu Takashi |
| 分类号 | H01L23/495;H01L21/50;H01L23/31;H01L23/00;H01L23/433 | 主分类号 | H01L23/495 |
| 代理机构 | Posz Law Group, PLC | 代理人 | Posz Law Group, PLC |
| 主权项 | 1. An electronic device comprising: a heat sink; a substrate constituting an electronic circuit, the substrate being mounted on the heat sink; a coating layer disposed on the substrate, the coating layer being made of one of a polyimide-based resin and a polyamideimide-based resin; a lead frame having a fixing terminal; an adhesive layer fixing the fixing terminal to the heat sink, the adhesive layer being made of the same material as the coating layer; and a mold resin sealing the substrate and the lead frame, the substrate being a hybrid IC substrate having a wiring board and an electronic part integrated with and mounted on the wiring board, the coating layer being disposed on a surface of the substrate opposite to the heat sink, and the mold resin being disposed directly on a top and side surfaces of the coating layer and completely surrounding the top and side surfaces of the coating layer. | ||
| 地址 | Kariya JP | ||