发明名称 Programmable metallization memory cell with layered solid electrolyte structure
摘要 Programmable metallization memory cells having an active electrode, an opposing inert electrode and a variable resistive element separating the active electrode from the inert electrode. The variable resistive element includes a plurality of alternating solid electrolyte layers and electrically conductive layers. The electrically conductive layers electrically couple the active electrode to the inert electrode in a programmable metallization memory cell. Methods to form the same are also disclosed.
申请公布号 US8772122(B2) 申请公布日期 2014.07.08
申请号 US201313940547 申请日期 2013.07.12
申请人 Seagate Technology LLC 发明人 Amin Nurul;Jin Insik;Tian Wei;Wirebaugh Andrew James;Vaithyanathan Venugopalan;Sun Ming
分类号 H01L21/20 主分类号 H01L21/20
代理机构 Mueting, Raasch & Gebhardt, P.A. 代理人 Mueting, Raasch & Gebhardt, P.A.
主权项 1. A method of forming a programmable metallization memory cell comprising: forming a first electrode; forming a variable resistive element by depositing a plurality of alternating solid electrolyte layers and electrically conductive layers comprising an electrochemically inert metal on the first electrode; and depositing a second electrode on the variable resistive element, the electrically conductive layers electrically couple the first electrode to the second electrode.
地址 Cupertino CA US