发明名称 |
Programmable metallization memory cell with layered solid electrolyte structure |
摘要 |
Programmable metallization memory cells having an active electrode, an opposing inert electrode and a variable resistive element separating the active electrode from the inert electrode. The variable resistive element includes a plurality of alternating solid electrolyte layers and electrically conductive layers. The electrically conductive layers electrically couple the active electrode to the inert electrode in a programmable metallization memory cell. Methods to form the same are also disclosed. |
申请公布号 |
US8772122(B2) |
申请公布日期 |
2014.07.08 |
申请号 |
US201313940547 |
申请日期 |
2013.07.12 |
申请人 |
Seagate Technology LLC |
发明人 |
Amin Nurul;Jin Insik;Tian Wei;Wirebaugh Andrew James;Vaithyanathan Venugopalan;Sun Ming |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
Mueting, Raasch & Gebhardt, P.A. |
代理人 |
Mueting, Raasch & Gebhardt, P.A. |
主权项 |
1. A method of forming a programmable metallization memory cell comprising:
forming a first electrode; forming a variable resistive element by depositing a plurality of alternating solid electrolyte layers and electrically conductive layers comprising an electrochemically inert metal on the first electrode; and depositing a second electrode on the variable resistive element, the electrically conductive layers electrically couple the first electrode to the second electrode. |
地址 |
Cupertino CA US |