Conductive pads defined by embedded traces

摘要

An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

主权项

1. An assembly comprising:
a first component including a dielectric region having an exposed surface; a continuous groove extending in a path along the surface, the groove having a floor disposed below the surface; a conductive pad exposed at the surface permitting electrical interconnection of the first component with a second component, the conductive pad defined by a conductive element having cross-sectional dimensions at least partly defined by the groove, extending from the floor of the groove to a height above the floor, and having at least a portion extending in at least one of an oscillating or spiral path along the surface, the path being formed so as to intersect a straight line along the surface more than three times, the conductive element having at least two adjacent portions separated by a portion of the surface of the dielectric region, and the conductive element having a length along the surface that is at least ten times greater than the height; and an electrically conductive bonding material having a melting temperature below 300° C. joined to the conductive pad and bridging the portion of the surface between the at least two adjacent portions of the conductive element.