发明名称 Method of making conductive pattern
摘要 A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
申请公布号 US8769805(B2) 申请公布日期 2014.07.08
申请号 US201012842103 申请日期 2010.07.23
申请人 Avery Dennison Corporation 发明人 Coleman James P.;Edwards David N.;Forster Ian J.;Iyer Pradeep S.;Licon Mark A.
分类号 H01P11/00;H01Q13/00 主分类号 H01P11/00
代理机构 Avery Dennison Corporation 代理人 Avery Dennison Corporation
主权项 1. A method of making an RFID device, the method comprising: printing graphics on a front surface of a dielectric substrate; forming a conductive pattern on a conductive substrate, the forming includes depositing a conductive ink layer onto the conductive substrate and placing a conductive material onto the conductive ink layer; and after the printing, adhesively transferring the conductive pattern to a back surface of the dielectric substrate.
地址 Glendale CA US
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