APPARATUS AND METHOD FOR PACKAGE REINFORCEMENT

摘要

A method and apparatus for a reinforced package are provided. A package component is electrically coupled to a device through a plurality of electrical connections. A molding underfill is interposed between the package component and the device and encapsulates the electrical connections or a subset of the electrical connections between the package component and the device. The package component also includes a molding compound. The electrical connections can be extended through the molding compound with the molding underfill interposed between the molding compound and the device to encapsulate the electrical connections or a subset of the electrical connections between the package component and the device. The molding underfill can be extended up along one or more sides of the package component.