| 发明名称 |
Semiconductor device and programming method |
| 摘要 |
The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. |
| 申请公布号 |
US8772953(B2) |
申请公布日期 |
2014.07.08 |
| 申请号 |
US200912404146 |
申请日期 |
2009.03.13 |
| 申请人 |
Spansion LLC |
发明人 |
Taya Koji;Onodera Masanori;Tanaka Junji;Meguro Kouichi |
| 分类号 |
H01L23/48;B29C45/16;H01L23/28;B29C45/02;H01L23/31;H01L25/065;H01L25/00;H01L21/56;H01L23/00;H01L23/552;B29C45/14 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating a semiconductor device comprising:
mounting a semiconductor chip on a chip mounting portion; coupling a wire between the semiconductor chip and the chip mounting portion disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip, wherein the wire is provided in contact with the sheet-shaped resin portion. |
| 地址 |
Sunnyvale CA US |
