| 发明名称 |
Solder mask with anchor structures |
| 摘要 |
Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site. |
| 申请公布号 |
US8772083(B2) |
申请公布日期 |
2014.07.08 |
| 申请号 |
US201113229687 |
申请日期 |
2011.09.10 |
| 申请人 |
ATI Technologies ULC;Advanced Micro Devices, Inc. |
发明人 |
Leung Andrew K W;Topacio Roden R.;Hsieh Yu-Ling;Low Yip Seng |
| 分类号 |
H01L21/00;H01L21/31 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
Honeycutt Timothy M. |
| 主权项 |
1. A method of manufacturing, comprising:
forming a first opening in a solder mask positioned on a side of a circuit board, the first opening not extending to the side, the solder mask including a photoactive compound; forming a second opening in the solder mask that extends to the side; and whereby the first and second openings being formed by lithographically patterning including masking first and second portions of the solder mask, exposing the solder mask with a first light dosage to leave the first and second portions uncured, masking the second portion but not the first portion of the solder mask, exposing the first portion of the solder mask with a second light dosage smaller than the first light dosage to leave a region of the first portion proximate the side uncured, and developing the solder mask to form the first and second openings. |
| 地址 |
Markham CA |
