发明名称 Method of manufacturing flexible substrate structure and flexible flat device
摘要 A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.
申请公布号 US8773625(B2) 申请公布日期 2014.07.08
申请号 US201213479252 申请日期 2012.05.23
申请人 AU Optronics Corp. 发明人 Li Wen-Yuan;Chiu Pin-Hsiang;Hsueh Yu-Chieh;Chen Li-Yin;Wei Min-Chih;Lin Shiuan-Iou
分类号 G02F1/13;G02F1/1333;B32B5/14;B32B7/12;H01L27/12 主分类号 G02F1/13
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A method of manufacturing a flexible substrate structure, comprising: providing a first loading substrate having a center area and a peripheral area disposed on at least one side of the center area; forming a first adhesive layer on the center area of the first loading substrate; forming a second adhesive layer on the peripheral area of the first loading substrate; adhering a first flexible substrate to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein an adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer; cutting the flexible substrate structure comprising cutting the second adhesive layer along a direction parallel to the first loading substrate and the first flexible substrate from a gap between the first loading substrate and the first flexible substrate; and separating the first flexible substrate from the first loading substrate, the first adhesive layer and the second adhesive layer.
地址 Science-Based Industrial Park, Hsin-Chu TW