| 摘要 |
The present invention relates to a method and an apparatus for bonding a substrate. The apparatus for bonding the substrate includes: a bonding chamber having upper and lower chambers; upper and lower platens installed in the upper and lower chambers to fix substrates to be bonded, respectively; a chamber opening/closing unit for allowing the upper and lower chambers to be separated from or adhere to each other by elevating the upper chamber; and an alignment means for allowing a first substrate to free fall vertically without sliding when the first substrate is de-chucked in state that, as the chamber opening/closing unit is elevated, and the upper chamber and the upper platen fall down so that the first substrate approaches to a second substrate. By using the apparatus for bonding the substrate, the first substrate is enabled to free fall vertically without sliding in a side direction, so that the first substrate is aligned with and bonded to the second substrate. Therefore, two substrates are aligned with and bonded to each other. |
