| 发明名称 |
Integrated circuit chip with reduced IR drop |
| 摘要 |
An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction. |
| 申请公布号 |
US8772928(B2) |
申请公布日期 |
2014.07.08 |
| 申请号 |
US201113205648 |
申请日期 |
2011.08.09 |
| 申请人 |
Mediatek Inc. |
发明人 |
Lin Chih-Ching;Chang Ya-Ting;Chuang Chia-Lin |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
| 主权项 |
1. An integrated circuit chip comprising:
a semiconductor substrate; a power/ground interconnection network in a topmost metal layer over the semiconductor substrate; and at least a bump pad on/over the power/ground interconnection network; wherein the power/ground interconnection network comprises a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction; wherein a plurality of fingers protrude from the connection portion. |
| 地址 |
Science-Based Industrial Park, Hsin-Chu TW |
