Semiconductor package structures having liquid cooler integrated with first level chip package modules

摘要

Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

主权项

1. An electronic apparatus, comprising:
a flexible chip carrier substrate having an IC (integrated circuit) chip flip-chip mounted on a first surface of the flexible chip carrier substrate and an area array of electrical contacts formed on a second surface of the flexible chip carrier substrate opposite the first surface; a metallic cooler device having upper and lower opposing surfaces and sidewall surfaces, wherein the lower surface of the metallic cooler device is thermally bonded directly to a backside surface of the IC chip; and a stiffener member that is bonded to the first surface of the flexible chip carrier substrate and is configured to provide mechanical rigidity to the flexible chip carrier substrate, wherein the metallic cooler device is mechanically coupled to the flexible chip carrier substrate by the stiffener member, and wherein the stiffener member comprises: a planar frame portion that lies substantially flat against the flexible chip carrier substrate; and a plurality of extended portions that are integrally formed with the planar frame portion and extend toward the metallic cooler device and away from the flexible chip carrier substrate at a first angle, wherein each the plurality of extended portions includes a bent end portion that is bent with respect to the rest of the extended portions at a second angle, the bent end portions are in contact with the sidewall surfaces of the metallic cooler device, the bent end portions of the plurality of extended portions being integrally formed with the rest of the extended portions.