MEMS sensing device and method for the same

摘要

The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.

主权项

1. A MEMS (Micro-Electro-Mechanical System) sensing device, comprising:
a substrate having a first surface and a second surface opposite the first surface; a MEMS device region on the first surface of the substrate, the MEMS device region including a chamber and a multilayer structure; a mask layer covering the multilayer structure, the mask layer having at least one mask opening which exposes the chamber; a film overlaying on the mask layer to seal the at least one mask opening so that the chamber is sealed as a sealed space; an adhesive layer disposed on the film; at least one opening located on the adhesive layer whereby the adhesive layer does not form a sealed space; a cover mounted on the MEMS device region and adhered by the adhesive layer; and a plurality of leads electrically connected to the MEMS device region and extending to the second surface.