Integrally molded die and bezel structure for fingerprint sensors and the like

摘要

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

主权项

1. A fingerprint sensor device, comprising:
a substrate; a die comprising fingerprint sensing circuitry and being secured to said substrate; a first conductive bezel secured to said substrate adjacent said die; and an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel; said die including a top surface configured to be electrically coupled with a fingertip; said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip.