Method of applying a microstructure, mould and article with a microstructure

摘要

The present invention relates to a method for applying a colored or colorless micropattern to a support, in which
a) a die form (40) is prepared whose surface exhibits an arrangement of elevations (42) and depressions (44) in the form of the desired micropattern,b) the depressions (44) in the die form are filled with a curable colored or colorless lacquer (26),c) the support (20, 30) is pretreated for a good anchoring of the colored or colorless lacquer (26),d) the surface of the die form (40) is brought into contact with the support (20, 30),e) the lacquer (26) that is in contact with the support (20, 30) in the depressions in the die form (40) is cured and, in the process, joined with the support (20, 30), andf) the surface of the die form (40) is removed from the support (20, 30) again such that the cured lacquer (26) that is joined with the support (20, 30) is pulled out of the depressions (44) in the die form (40).

主权项

1. A method for applying a colored or colorless micropattern to a support, comprising the steps wherein
a) a die form is provided whose surface exhibits an arrangement of elevations and depressions in the form of the desired micropattern, b) the depressions in the die form are filled with a curable colored or colorless lacquer, c) the support is pretreated for an anchoring of the colored or colorless lacquer, d) in each case, the filled section of the die form is introduced to the pretreated support and brought into contact with the support, e) the lacquer that is in contact with the support in the depressions in the die form is cured and, in the process, joined with the support, and f) the surface of the die form is removed from the support again such that the cured lacquer that is joined with the support is pulled out of the depressions in the die form; wherein the support comprises a transparent plastic foil or a paper layer; and wherein the micropattern is for use in a micro-optical moiré magnification arrangement, characterized in that the micropattern in the die form is formed by micropattern elements having a line width between about 1 μm and about 10 μm.