| 发明名称 | Method of encapsulating an electronic arrangement | ||
| 摘要 | The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. | ||
| 申请公布号 | US8771459(B2) | 申请公布日期 | 2014.07.08 |
| 申请号 | US201012774788 | 申请日期 | 2010.05.06 |
| 申请人 | tesa SE | 发明人 | Keite-Telgenbüscher Klaus;Ellinger Jan;Krawinkel Thortsten;Steen Alexander |
| 分类号 | B29C65/40;H05K1/16 | 主分类号 | B29C65/40 |
| 代理机构 | Norris McLaughlin & Marcus PA | 代理人 | Norris McLaughlin & Marcus PA |
| 主权项 | 1. A method of encapsulating an electronic arrangement with respect to permeants, comprising encapsulating an electronic arrangement by completely enclosing the arrangement with an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride modified vinylaromatic block copolymers. | ||
| 地址 | Hamburg DE | ||