Silicon-based cooling package for light-emitting devices

摘要

Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.

主权项

1. An apparatus, comprising:
a silicon-based base plate, the base plate including a recess configured to receive a light-emitting device therein, a first area of the base plate coated with a first electrically-conductive pattern that forms a first electrode for powering the light-emitting diode, a second area of the base plate coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern; and a silicon-based cover element, the cover element configured to be disposed on the base plate to hold the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed, an area of the cover element coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode together with the second electrically-conductive pattern for powering the light-emitting device when the cover element is disposed on the base plate.