| 摘要 |
The present invention relates to an apparatus for bonding substrates which includes: an upper chamber which supports an upper surface plate to which a first substrate is bonded; a lower chamber which is installed to be opposed to the upper chamber, and supports a lower surface plate to which a second substrate is bonded; a chamber opening and closing means which lifts up the upper chamber with respect to the lower chamber to separate or put together the upper chamber and the lower chamber; and a parallel sensing means which is installed on a contact surface, opposed to the upper chamber or a lower chamber, to measure a degree of parallelization as the upper chamber and the lower chamber contact with each other. Accordingly, the degree of parallelization of the upper chamber, lifted up with respect to the lower chamber, can be measured. When the degree of parallelization of the upper chamber is not constant, the upper chamber is adjusted to be parallel; and then a bonding process is performed. Therefore, the number of defective products, cause by the bonding process, is reduced; and consequently efficiency of the bonding process is increased. |
