| 摘要 |
PROBLEM TO BE SOLVED: To provide a light irradiation device which is less susceptible to heat generated from an ultraviolet light-emitting element, even if the mounting density of ultraviolet light-emitting element is relatively high, and which achieves relatively high ultraviolet light irradiation energy.SOLUTION: A light irradiation module includes a light irradiation device 2 where a light-emitting element 20 is arranged on one principal surface 11a of a substrate 10, and a planar heat dissipation member 100 is arranged on the other principal surface 11b of a substrate 10. The light irradiation device 2 has a bonding pad 70 at a position corresponding to the light-emitting element 20. The heat dissipation member 100 has a protrusion 100a at the position corresponding to each bonding pad 70 on the surface 101 on the light irradiation device 2 side, and the corresponding bonding pad 70 and protrusion 100a are bonded via a metal bonding material 80. The light irradiation module is less susceptible to heat generated from the light-emitting element 20, and relatively high light irradiation energy can be achieved. |
