| 摘要 |
Provided is a copper foil for a printing circuit in which after a first particle layer of copper is formed on the surface of a copper foil, a second particle layer of a ternary alloy comprising copper, cobalt and nickel is formed on top of the first particle layer. The copper foil for a printing circuit is characterized by the ratio of the three-dimensional surface area with respect to the two-dimensional surface area for a given region of a roughened face being at least 2.0 and no more than 2.2 according to laser microscope. The copper foil for a printing circuit as described in claim 1 is characterized by an average particle diameter of 0.25 to 0.45µm for the first particle layer of copper, and an average particle diameter of 0.35µm or less for the second particle layer of a ternary alloy comprising copper, cobalt and nickel. |
