CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a core substrate to be utilized for manufacturing a substrate with built-in electronic components, a substrate with built-in electronic components improved in mechanical characteristics and reliability, and a method for manufacturing the same.SOLUTION: A substrate with built-in electronic components comprises: a core substrate 10 provided with a cavity 10a and including a first insulating layer 11 and a second insulating layer 13 stacked on upper and lower parts of the first insulating layer 11, where the second insulating layer 13 is made of a material with a glass transition temperature lower than that of the first insulating layer 11; and an electronic component 20 fixed by an insulating material 12 flown from the first insulating layer 11 by being inserted into the cavity 10a.