发明名称 THERMOSETTING COMPOSITION AND CURED MATERIAL THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting composition that can produce a cured material of heat dissipating polyurethane resin capable of maintaining the flexibility for a long period of time, and a cured material thereof.SOLUTION: Provided are a thermosetting composition containing: a (meth)acrylate copolymer (A) comprising a (meth)acryl monomer unit having a polydialkylsiloxane backbone of 700 to 12,000 molecular weight, and a (meth)acryl monomer unit having, in the side chain portion, polyethylene oxide chains having an average repeating number of 2 to 20 and having the hydroxy group at the terminal of the polyethylene oxide chain encapsulated by a non-reactive functional group; polyol (B) that has a polyalkylene oxide chain having an alkylene oxide chain of 3 to 6 carbon atoms as a repeating unit; polyisocyanate (C); and heat dissipating material (D), and a cured material obtained by thermal curing the composition.
申请公布号 JP2014125521(A) 申请公布日期 2014.07.07
申请号 JP20120282594 申请日期 2012.12.26
申请人 DIC CORP 发明人 YAMAGUCHI HIROBUMI;UJIHARA TEPPEI
分类号 C08G18/48;C08K3/02;C08K3/28;C08L33/10;C08L55/00;C08L75/08 主分类号 C08G18/48
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