| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component storing package capable of improving connection reliability between an input/output terminal and lead terminals.SOLUTION: An electronic component storing package 2 includes: a substrate 4 having a mounting area of an electronic component; a frame-shaped ceramic frame body 5 arranged on the substrate 4 so as to surround the mounting area and having upper and lower surfaces; a plate-like input/output terminal 8 arranged through the ceramic frame body 5 and provided with a first projection part 83 projected from the ceramic frame body 5 to an external direction; and a plurality of lead terminals 9 arranged on the first projection part 83 of the input/output terminal 8. The ceramic frame body 5 includes a pair of second projection parts 52 arranged on both right and left sides of the first projection part 83 and projected to the external direction, and the pair of second projection parts 52 each having vertical thickness thicker than the vertical thickness of the first projection part 83 are connected to both right and left side parts of the first projection part 83. Thereby, connection reliability between the input/output terminal 8 and the lead terminals 9 can be improved. |
