发明名称 SEALING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a sealing sheet capable of efficiently manufacturing an optical semiconductor device with excellent strength while suppressing a gas from passing through a thickness direction.SOLUTION: A sealing sheet 1 for sealing an optical semiconductor element 5 comprises an embedded layer 2 for embedding the optical semiconductor element 5 and a gas barrier layer 3 of 50 μm to 1,000 μm in thickness which is disposed on the embedded layer 2 and suppresses a gas from passing through a thickness direction.
申请公布号 JP2014127575(A) 申请公布日期 2014.07.07
申请号 JP20120282903 申请日期 2012.12.26
申请人 NITTO DENKO CORP 发明人 KATAYAMA HIROYUKI;MITA RYOTA;KIMURA RYUICHI;ITO HISATAKA
分类号 H01L33/52;H01L23/29;H01L23/31 主分类号 H01L33/52
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