WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress warpage of a wiring board.SOLUTION: The wiring board comprises: a substrate 100 (core substrate) which has a surface F11 and a surface F12 opposite thereto and in which a through-hole 100c is formed; a conductor layer 100a (including a first conductor pattern) formed on the surface F11 of the substrate 100; a conductor layer 100b (including a second conductor pattern) formed on the surface F12 of the substrate 100; and a through-hole conductor 100d which is constituted of a conductor filling the through-hole 100c of the substrate 100 and connects the first conductor pattern and the second conductor pattern. The substrate 100 comprises: a glass layer 1010 (core layer) having a surface F1 and a surface F2 opposite thereto; a resin layer 1011 (first resin layer) provided on the surface F1 of the glass layer 1010 and having the surface F11; and a resin layer 1012 (second resin layer) provided on the surface F2 of the glass layer 1010 and having the surface F12.