发明名称 MULTILAYER ELECTRONIC COMPONENT AND AGGREGATE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent deterioration of a second layer, e.g., oxidization due to provision of an identification mark and to eliminate the necessity of a filling process in a multilayer electronic component.SOLUTION: A multilayer electronic component includes a multilayer substrate 10 formed by laminating a plurality of layers 11, 15. The multilayer substrate 10 includes a surface layer 11a arranged on one principal surface of the multilayer substrate 10, and a second layer 15a arranged in contact with the surface layer 11a. The second layer 15a has a color different from that of the surface layer 11a, a partial recess 12 not reaching the second layer 15a is formed in the surface layer 11a, and the surface layer 15a can be identified from the recess 12.
申请公布号 JP2014127486(A) 申请公布日期 2014.07.07
申请号 JP20120280793 申请日期 2012.12.25
申请人 MURATA MFG CO LTD 发明人 ASADA SATOSHI;WATANABE SHINYA;MURAOKA KUNIYOSHI;UEDA TAKESHI
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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